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MBR230LSFT1
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5
PACKAGE DIMENSIONS
SOD-123LF
CASE 498-01
ISSUE A
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
D
E
b
A
A1
L
c
POLARITY INDICATOROPTIONAL AS NEEDED
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT
SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM
FROM THE LEAD TIP.
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 0.95 1.00 0.035
INCHES
A1
0.00 0.05 0.10 0.000
b
0.70 0.90 1.10 0.028
c
0.10 0.15 0.20 0.004
D
1.50 1.65 1.80 0.059
E
2.50 2.70 2.90 0.098
L
0.55 0.75 0.95 0.022
0.037 0.039
0.002 0.004
0.035 0.043
0.006 0.008
0.065 0.071
0.106 0.114
0.030 0.037
NOM MAX
3.40 3.60 3.80 0.134
0.142 0.150
HE
-
-
0°
8°
0°
8°
1.22
0.048
0.91
0.036
2.36
0.093
4.19
0.165
SCALE 10:1
mm
inches
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e changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's
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MBR230LSFT1/D
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